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US Patent Issued to Taiwan Seimconductor Manufacturing on Sept. 22 for "Wafer storage device with particle-attraction object" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,598, issued on Sept. 22, was assigned to Taiwan Seimconductor Manufacturing Co. Ltd. (Hsin-Chu, Taiwan). "Wafer storage device with partic... Read More


US Patent Issued to Daifuku on Sept. 22 for "Transport facility" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,599, issued on Sept. 22, was assigned to Daifuku Co. Ltd. (Osaka, Japan). "Transport facility" was invented by Kengo Ikedo (Komaki, Japan)... Read More


US Patent Issued to EV Group E. Thallner on Sept. 22 for "Method and device for the alignment of a substrate" (Austrian Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,600, issued on Sept. 22, was assigned to EV Group E. Thallner GmbH (St. Florian am Inn, Austria). "Method and device for the alignment of ... Read More


US Patent Issued to Micron Technology on Sept. 22 for "Mount tape having an inner support layer between adhesive layers for semiconductor device assembly" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,601, issued on Sept. 22, was assigned to Micron Technology Inc. (Boise, Idaho). "Mount tape having an inner support layer between adhesive... Read More


US Patent Issued to TEL Manufacturing and Engineering of America on Sept. 22 for "Multi-wafer handling system" (Massachusetts Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,602, issued on Sept. 22, was assigned to TEL Manufacturing and Engineering of America Inc. (Chaska, Minn.). "Multi-wafer handling system" ... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 22 for "Pick-and-place tool with warpage-correction mechanism" (Taiwanese Inventor)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,603, issued on Sept. 22, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Pick-and-place tool with warpage-... Read More


US Patent Issued to Applied Materials on Sept. 22 for "In situ film growth sensor assembly, apparatus, and methods" (California, Arizona Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,604, issued on Sept. 22, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "In situ film growth sensor assembly, apparatus, an... Read More


US Patent Issued to NICHIA on Sept. 22 for "Method of manufacturing light emitting device" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,605, issued on Sept. 22, was assigned to NICHIA Corp. (Anan, Japan). "Method of manufacturing light emitting device" was invented by Hiroa... Read More


US Patent Issued to Micron Technology on Sept. 22 for "Memory device structure and forming method including reticle adjustment" (Idaho Inventor)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,606, issued on Sept. 22, was assigned to Micron Technology Inc. (Boise, Idaho). "Memory device structure and forming method including reti... Read More


US Patent Issued to AUO on Sept. 22 for "Display panel having sub-pixels with different orienting characteristics, and a manufacturing method thereof" (Taiwanese Inventor)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,607, issued on Sept. 22, was assigned to AUO Corp. (Hsinchu, Taiwan). "Display panel having sub-pixels with different orienting characteri... Read More